Wafer-level Packaging Equipment

Global “Wafer-level Packaging Equipment Market” an overview of the global market is provided with a prime focus on factors boosting and hampering the market. This will help investors get a clear understanding of which aspects to focus on and how to economically support the market globally. The impact of the prevailing regulatory scenarios on both regional and worldwide Wafer-level Packaging Equipment market is provided in detail in the report.

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendors/manufacturers in the market. The key manufacturers covered in this report:

  • Applied Materials
  • Tokyo Electron
  • KLA-Tencor Corporation
  • EV Group
  • Tokyo Seimitsu
  • Disco
  • SEMES
  • Suss Microtec
  • Ultratech
  • Rudolph Technologies

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    Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the worlds largest wafer-level packaging equipment producer.Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer. According to this study, over the next five years the Wafer-level Packaging Equipment market will register a 8.9% CAGR in terms of revenue, the global market size will reach US$ 3090 million by 2024, from US$ 2010 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Wafer-level Packaging Equipment business.   

    Segmentation by product type:

  • Fan In
  • Fan Out

    Segmentation by application:

  • Integrated Circuit Fabrication Process
  • Semiconductor Industry
  • Microelectromechanical Systems (MEMS)
  • Other

    This report also splits the market by region:

    • Americas
    • United States
    • Canada
    • Mexico
    • Brazil
    • APAC
    • China

    This report includes the estimation of market size for value (million US$) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of the Wafer-level Packaging Equipment market, to estimate the size of various other dependent submarkets in the overall market. All percentage shares split, and breakdowns have been determined using secondary sources and verified primary sources.

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    Research objectives

    To study and analyze the global Wafer-level Packaging Equipment consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.

    To understand the structure of the Wafer-level Packaging Equipment market by identifying its various subsegments.

    Focuses on the key global Wafer-level Packaging Equipment manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in the next few years.

    To analyze the Wafer-level Packaging Equipment with respect to individual growth trends, future prospects, and their contribution to the total market.

    To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

    To project the consumption of Wafer-level Packaging Equipment submarkets, with respect to key regions (along with their respective key countries).

    To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

    To strategically profile the key players and comprehensively analyze their growth strategies.

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